- The 2 mm thick mSSD reaches 6500 MB/s write speeds despite its size
- Longsys eliminates nearly 1,000 solder joints through wafer-level integration technology
- The MicroSSD reduces the defect rate from 1,000 DPPM to just 100
Longsys has introduced what it calls the industry’s first integrated packaging microSSD, or mSSD, using a design that fuses several key components into a single compact package.
The mSSD measures only 20 x 30 mm and is only 2 mm thick and weighs only 2.2 grams.
Despite its size, it supports PCIe Gen4x4 performance, reaching sequential read speeds of up to 7400MB/s and write speeds of up to 6500MB/s.
Integrated chip packaging
This device achieves random read and write numbers of up to 1000K and 820K IOPS respectively, keeping performance on par with larger M.2 drives.
Unlike traditional SSDs that rely on PCB assembly, the mSSD uses system-in-package (SiP) technology at the wafer level.
This approach integrates the controller, NAND flash, power management IC and other passive components in one package.
This eliminates nearly 1,000 solder joints typically found in PCB-based SSDs.
Longsys says (originally in Chinese) that this change improves overall reliability by reducing the defect rate from less than or equal to 1,000 defective parts per unit. million to less than or equal to 100.
The move also eliminates several manufacturing stages, such as PCB placement and reflow soldering, reducing complexity and the risk of solder mask contamination or heat damage.
With this system, Longsys says it can now complete manufacturing from wafer to finished product in a single process.
The company says this doubles delivery efficiency while cutting incremental production costs by more than 10%.
The design is also said to reduce energy consumption by eliminating the high-energy surface mount process, which can help control carbon emissions and support environmental compliance.
For thermal performance, Longsys uses a combination of aluminum alloy brackets, graphene patches and thermally conductive silicone to help dissipate heat.
It meets NVMe power standards, with idle power below 3.5 milliwatts and maximum consumption within specification limits.
Longsys’s mSSD supports both TLC and QLC NAND with capacities from 512GB up to 4TB.
It also includes a modular heatsink that can expand the form factor to M.2 2230, 2242 or 2280 standards without tools.
This makes it adaptable to a wide range of devices such as business laptops, handheld consoles, drones and VR headsets.
The mSSD is currently in the ramp-up to mass production, with patents filed both nationally and internationally.
While its small size and integrated design may appeal to manufacturers, its advanced packaging process may make it more expensive than traditional portable SSDs at launch.
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