Softbank and Intel aim to prototype new HBM -CHIP in 2026 with the hope of commercial launch in 2030


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Softbank and Intel are reportedly together to develop a new type of AI-focused high-band width memory, which they hope will compete with HBM products produced by South Korean tech giants Samsung and SK Hynix.

A report from Nikkei Asiaclaims that the couple aims to create stacked drama chips with a new wiring structure that cuts the power consumption by half compared to current HBM chips.

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