AMD revealed more about its 128-GPU MI355X DLC RACK and plans for the MI400 that made its look next year


  • AMD highlighted the MI350 Series on Hot Chips 2025 with Node-to-Rack Scalability
  • MI355X DLC Rack has 128 GPUs 36TB HBM3E and 2.6 Exaflops
  • Nvidias Vera Rubin system coming next year is a maximum scale animal

AMD used the recent Hot Chips 2025 event to talk more about the CDNA 4 architecture that drives its new instinct MI350 series and shows how its accelerators are scaled from the node to rack.

The MI350 series platforms combine the 5th gene EPYC CPUs, MI350 GPUs and AMD Pollara Nics in OCP standard design with UEC supported network. Bandwidth is delivered through Infinity Fabric at up to 1075 GB/s.

At the top end of this is the MI355X DLC ‘ORV3’ Rack, a 2ou system with 128 GPUs, 36 TB HBM3E memory and top flow of 2.6 Exaflops at FP4 precision (there is also a 96-GPU EIA version with 27 TB HBM3E).

(Image Credit: AMD)

Here’s Vera Rubin

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