- Intel is expanding its Liquid Cooling Tech to support Nvidia’s future AI chips
- Superfluid cooling tackles 1.5 kw heat load for high performance systems
- Taiwan Partnerships Position Intel as Cooling Manager for Next Genes Chips
It’s no secret that Intel, who recently appointed Lip-Bu Tan for his new CEO, faces difficult times.
The iconic chipmaker is reportedly considering spinning his foundry department for a joint venture with TSMC in an attempt to turn things around, but separate from these plans, Intel is also looking to change the wealth by becoming a big player in cooling next generation AI hardware.
The company’s superfluid cooling solution is reportedly able to control the heat output up to 1.5 kW per day. Chip, a benefit level that can be important to cool Nvidia’s GB300 Superchip and also for upcoming rack servers, such as those shown on the GTC 2025.
Blows bubbles
In his case, Nvidia revealed mock-ups of Kyber-based NVL576 racks with Rubin Ultra GPUs.
According to Nvidia’s co-founder, president and CEO Jensen Huang, these systems could pull as much as 600 kW, with future racks that potentially reach megawatt level power needs. As the energy requirements grow, advanced cooling solutions such as Intel’s superfluous technology will become increasingly important.
Superfluid cooling was first introduced by Intel in 2023 and uses microbobble injection to improve the coolant stream and heat transmission efficiency.
Mashdigi Reports The technology draws inspiration from a method used by Mitsubishi Heavy Industries, “where bubbles are generated under the hull of seabound ships to reduce water resistance and improve propulsion efficiency.”
The site continues to explain that in case of super fluid cooling, “a similar approach is applied by generating bubbles in the coolant to increase the flow rate and improve heat removal. This is combined with cold plate design to further improve thermal conductivity.
In addition, the system uses a new type of non-conductive dielectric fluid to prevent damage to submerged servers in case of leakage. “This approach makes it very suitable for dense computer environments, where traditional cooling methods fall short.
Intel recently showed its progress at the 2025 SuperFluid Advanced Cooling Technology Forum in Taiwan, which hosted the Industrial Technology Research Institute.
According to United Daily News Network (Tender)The event drew over 500 participants and more than ten local suppliers and highlighted strong industrial interest. Taiwanese companies including Maico, Yuanshan, Kuenling and Sun Max Tech presented hardware built to support Intel’s cooling system, including server racks, fluid -cooled chassis and thermal components.
Intel is reportedly also investing in advanced materials to reduce corrosion and mechanical wear, including liquid metal -based designs and electromagnetic pump systems to improve prolonged durability and reduce the maintenance of large implementations.
