- TDKS Spin -Fotodetector pushes AI -Data speeds ten times beyond today’s tech
- AI bottle neck can disappear when TDK shifts focus from GPU to data transfer
- Spin Photo Detector uses laser -induced magnetism for ultraast photoelectric conversion
Japanese producer TDK has claimed that it has achieved a major breakthrough in the solution of one of the most urgent problems in artificial intelligence. No, not GPU -evil, but rather data transfer.
Its innovation, called the spin photodetector, combines magnetic, optical and electronic technologies to move data at speeds up to ten times faster than existing semiconductor-based photo detectors can offer.
TDK’s device reaches response speeds of only 20 picoseconds – or 20 trillion of a second – using light at a wavelength of 800 nanometers.
TDK’s spin -photodetector
“This data transfer is the largest bottleneck for AI rather than Semiconductor GPU performance,” said Hideaki Fukuzawa, senior manager for the company’s next generation product development center.
“Since we can break through many of the current bottlenecks, we think this technology will be a game election for AI and the data center industry.”
To achieve this, TDK re -developed its magnetic tunnel intersection (MTJ) technology used previously in billions of hard disk heads.
The MTJ structure is only 200 nanometers wide and integrates a single COFEB -free layer that responds to laser impulses. It offers the opportunity to switch from parallel to antiparallal magnetic conditions with 100% reliability under defined conditions.
Unlike semiconductors who depend on the bearing generation and facial restrictions at short wavelengths, spin -photodetectors use electron heating, enabling faster speeds and wider spectral coverage. The MTJ elements are also resistant to cosmic rays, making them ideal for aviation use.
“The spin photo detector has a remarkable promise, both from a scientific and technological perspective,” said Arata Tsukamoto, professor of electrical engineering at Nihon University, who collaborated with TDK on validation.
TDK’s unit demonstrated effective operation across a wide range of wavelengths from 300 Nm to 1.6 UM. Its ultraastic analog light detection capability, energy efficiency and compact size open potential applications in AR/VR-smart glasses, high-speed depiction and space systems. This development can also help solve problems with power consumption in AI implementation.
Technology can serve markets where fast data transfer with low latency is crucial to AI workloads and graphics-heavy tasks.
TDK expects to deliver samples by March 2026 and aim for mass production within five years. Thanks to the few treatment steps required, it expects to maintain a cost advantage and challenge larger chipmakers such as TSMC and NVIDIA that invest a lot in silicon photonics.
Via the Financial Times
