- Qualcomm shows a plate-shaped Snapdragon Mini PC at its summit in 2025
- Ultra thin Snapdragon x2 Elite Reference Desktop Concept Cooled with Airjet modules
- Whether it will see the light of day is uncertain but the concept shows potential
At his recent Snapdragon 2025, Qualcomm participants with two new reference -written driven by its upcoming Snapdragon X2 Elite Chips surprised.
Among them was the most unusual design a flat, circular computer that could easily be confused with a mug of warmer or wireless charger, according to PCMAG‘s John Burek, who photographed the device.
The ultra-thin mini-PC is less than half an inch thick and just slightly larger than a teacup.
Airjet cooling
On its sides are a handful of USB-C ports and a headphone jack with a ring of ventilation openings below, which Burek points out, is reminiscent of the Mac Mini.
The on-screen machine was connected to a full-size screen over USB-C while driving Snapdragon Silicon in real time.
Cooling such a slim unit is an obvious challenge, and Qualcomm turned to Frore Systems’ Airjet technology for this.
Instead of relying on fans, Airjet modules use thermoelectric materials that pulses air through the cooling plate silently.
Without moving parts avoiding cooling mechanical wear and noise while allowing far thinner design.
Qualcomm noted that Airjet is an option that is currently being explored, with traditional fans or fully fanless approaches also possible depending on performance goals.
Saucer PC appeared next to another modular all-in-a-desktop, illustrating Qualcomm’s interest in exploring form factors in addition to laptops and tablets.
Burek reported that Qualcomm is working with three Taiwan-based OEMs on the reference models, raising the chance that some of the designs could reach the market.
Looking at the pictures of the plate-like computer, the Voyo V3 PC brought to mind in mind that we underwent in 2016.
This unit measured less than 10 mm thick and weighed less than 200 g. It depended on a cherry trail nuclear chip with low power pulling, but thermal problems limited performance due to the lack of a fan or heat-dividing chassis.
Compared to this machine, Qualcomm’s reference Desktop is just as striking slim, but promises significantly higher performance thanks to its more powerful arm -based chips and modern cooling.
The new concept shows how Snapdragon -Hardware could expand to new categories, and while this plate design may never pass the prototype phase, I will definitely be ahead of the queue if it ever does.
